Recently introduced techniques for whole wafer mapping and imaging create new possibilities for root cause analysis of emitter passivation defects. Inline compatible PL imaging identifies such defects as localized regions with increased emitter saturation current and reduced implied open circuit voltage. Advanced offline evaluation of defective areas can be then performed with multiparameter noncontact measurements capable to establish the role of surface recombination, the interface trap density, or the dielectric charge that controls the field-effect passivation. The relevant novel metrologies are discussed and are illustrated using examples of advanced silicon passivation by dielectric films and by a-Si heterojunction
